Specifications for headphone structure design

The specifications for headphone structure design need to comprehensively consider multiple factors such as acoustic performance, ergonomics, durability, manufacturing feasibility, and cost control.

The following are some key points of specifications for headphone structure design:

1、 ID section

a. Check if the appearance meets the CMF requirements

b. Check if the appearance of the ID parting line position is acceptable

If the parting line in the ID is a curve (as shown in the bottom left figure) and not in the same plane, it needs to be confirmed whether it is acceptable after being adjusted to be in the same plane;

c. Check for interference between plastic, hardware, and PCBA components

d. The left and right earphones should have L and R markings on the outside

2、 Acoustic section

a. The design diameter of the assembly horn position should be 0.1mm larger than the horn specification;

b. The center of the speaker should be aligned with the center of the sound hole, and the sound hole should be designed as smooth as possible;

c. Speaker height dimension=Speaker specification height+1mm welding wire height

When designing, the shell material should avoid a gap of 0.3mm or more on this basis;

3、 Electronic part

a. Check if the placement of components on both sides of the PCBA meets the design requirements and if there is any interference;

b.After the PCBA is installed, there should be no interference with the top height, and the bottom surface of the PCBA should have surface mounted ICs or higher components

At the corresponding position of the lower (upper) cover, a gap of at least 0.2mm should be made to reduce adhesive and avoid gaps

4、 Structural design and assembly section

a. Check if there is a reinforced design for each rotating connection part;

b. Check if there is a glue slot or pressure screw for fixing the horn:

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